摘要
以抗坏血酸(VC)为还原剂,以聚乙烯醇为分散剂还原氯金酸制备金粉,制备得到粒径为1~3μm的高致密球形金粉末。用SEM对所制金粉进行了表征,分析分散剂的不同用量对金粉形貌和粒径的影响,还原剂滴加速度对金粉形貌和粒径的影响。将所制金粉配制成金浆料,丝网印刷高温烧结后,表征金膜特性。结果表明该金粉可用于制备厚膜金导体浆料。
Gold powder was prepared by reduction of chloro auric acid with ascorbic acid(VC)as reducing agent and polyvinyl alcohol as dispersant,high density gold powder with a diameter of 1-3 microns.The prepared gold powders were characterized by SEM,the influence of different dosage of dispersant on the morphology and particle size of gold powder was analyzed,effect of reducing agent adding speed on the morphology and particle size of gold powders.The gold powder is made into gold slurry,characterization of gold film characteristics after screen printing high temperature sintering.The results showed that the gold powder can be used for preparing thick film gold conductor paste.
作者
关俊卿
滕海涛
陈峤
王鹏
李治宇
GUAN Junqing;TENG Haitao;CHEN Qiao;WANG Peng;LI Zhiyu(GRIKIN Advanced Materials Co.Ltd.,Beijing 102200,China)
出处
《贵金属》
CAS
CSCD
北大核心
2018年第A01期97-100,共4页
Precious Metals
关键词
金属材料
金粉
金浆料
厚膜导体
丝网印刷
metal materials
gold powder
gold paste
thick film conductor
screen printing