电子封装用导热环氧树脂基复合材料的研究进展

Research Progress of Thermal Conductive Epoxy Matrix Composites for Electronic Packaging

环氧树脂是电子封装的常用材料,但其热导率仅有0.2W/(m·K)左右,添加高导热填料是提高环氧树脂导热性能的常用手段。对电子封装用导热环氧树脂基复合材料的导热机理和导热模型进行了综述,介绍了几种常用填料对复合材料导热性能的影响,并对电子封装用导热环氧树脂基复合材料未来的发展方向进行了展望,指出目前仍有许多问题需要解决,所制备的材料热导率不能满足应用要求,导热机理和模型也还需要进行更深入的研究。

Epoxy resin is a common material for electronic packaging,but its thermal conductivity is only about 0.2 W/(m·K).Adding high thermal conductivity filler is a common means to improve the thermal conductivity of epoxy resin.The thermal conductivity mechanism,thermal conductivity model of epoxy resin composite for electronic packaging were reviewed,and the influence of related fillers on the thermal conductivity of composite was presented.The future development direction of epoxy resin composite for electronic packaging was prospected.It was pointed out that there were still many problems to be solved,the thermal conductivity of the prepared materials could not meet the application requirements,and the thermal conductivity mechanism and model also needed to be further studied.