摘要
本文主要介绍组件封装腔体内水汽含量的来源及失效种类,并针对各种水汽含量来源提出了对应的可能解决方案。
This paper mainly introduces the sources and failure types of water vapor content in the sealing chamber of components,and puts forward the corresponding possible solutions to various sources of water vapor content.
作者
赵晓明
Zhao Xiaoming(The 2nd Research Institute of CETC,Taiyuan Shanxi 030024,China)
出处
《山西电子技术》
2018年第6期22-25,共4页
Shanxi Electronic Technology
关键词
多芯片模块
腐蚀
水汽
multi-chip module
corrosion
the water vapor
