全自动激光去溢料技术的应用

The Application of De-flashing Technology by Using Full-automatic Laser

集成电路封装采用传统热压模具实现芯片包封。为了防止模具合模时产生真空,造成离注塑流道较远的型腔注塑不满,需要在模具的适当位置开设气槽,但是这样会使塑封体上存在飞边,影响产品品质;基于这个问题国内国际均采用模具冲裁完成,可模具冲裁后,在引线框架的侧壁上有塑封料的残留,影响产品品质,并且模具冲裁速度慢,直接影响产品的加工产量。鉴于上述问题,为了去除产品在生产中残留的塑封料,提高产量,经公司研发中心长时间的调研及实验,研发出全自动激光去溢料技术来解决这一技术难题,并提高了生产效率。

The assembly of integrated circuitsiscarried out by using the traditional hotpressing mold.In order to prevent the generation of vacuum when the mold closes,it is not satisfied that cavity injection of the cavity is far from the injection flow.A gas tank shall be opened in the appropriate position of the mold.But this will make the plastic body have the flash.It will affect the product quality.Based on this problem,the die cutting is used in the domestic and international,but after the die cutting,the residual of plastic sealing material remains on the side wall of the lead frame,which will affect the product quality.However,thedie cutting speed gets slow,which will directly affect the processing output.we have developed the de-flash technology of the full-automatic laser to solve this problem and improve the production efficiency in order to remove the product residues of encapsulation materials in the production period and improvetheoutput.