乙二胺四乙酸体系中原位还原法制备银包覆铜粉

Preparation of silver coated copper powder by in-situ reduction method in ethylene diamine tetraacetic acid system

在乙二胺四乙酸(EDTA)-Ag(I)-Cu(II)-H_2O体系中,以铜粉为基体、硝酸银为银源、聚乙烯吡咯烷酮(PVP)为分散剂、1,4-丁炔二醇为整平剂,采用原位还原法制备银包覆铜粉;使用扫描电镜(SEM)、X射线衍射测试仪(XRD)、物镜球差校正场发射透射电镜(STEM-EDS)、同步热分析仪(TGA)、比表面及空隙分析仪(BET)等仪器对产品进行了系统表征。结果表明:银在铜粉基体上包覆成功,且包覆层厚度达100～150 nm;产品呈分散性良好的多面体颗粒,粒径约2.5μm;TGA检测结果表明,银包覆层的增加提升了铜粉的抗氧化性。

Using the copper powders as the substrate,the silver nitrate as the silver resource,PVP as the dispersant and1,4-butylene glycol as the leveling agent,silver coated copper powders were prepared by in-situ reduction method in ethylene diamine tetraacetic acid(EDTA)-Ag(Ⅰ)-Cu(Ⅱ)-H2O system.The products were systematically characterized by using scanning electron microscopy(SEM),X-ray diffraction meter(XRD),optical lens spherical aberration correction field emission transmission electron microscopy(STEM-EDS),simultaneous thermalanalyzer(TGA),specific surface and void analyzer(BET)and other instruments.The results show that silver is successfully coated on copper substrate and the thickness of plating layer is about100-150nm.Silver coated copper powders are a kind of polyhedron granules with good dispersibility,whose particle size is about2.5μm.The TGA test results show that the increase of silver plating layer improves the oxidation resistance of copper powder.