探究芯片环境温度T_a及芯片壳体温度T_c值

Probe Chip Ambient Temperature and Chip Case Temperature

实际工作中,很多电子产品热设计工程师误将测得的芯片壳体温度当做芯片的环境温度(即芯片工作温度),从而导致对热设计结果的误判,或导致热设计冗余量过大后使设备成本不恰当地被提高。为了避免此类问题的再次发生,论文引入热边界层理论探究芯片环境温度和芯片壳体温度。论文从多个层面介绍了有效获取芯片环境温度及芯片壳体温度的方法。由于芯片表面或散热器表面热边界层的客观存在,不可避免地在芯片壳体与边界层外的空气之间产生一定的热阻,使得芯片厂家提供的芯片工作温度必然低于芯片壳体温度。

In practice,many electronic product thermal design engineers mistake case temperature of chip as operation temperature of chip,leading to the misjudge of thermal design,or resulting in excessive thermal design redundancy and improperly higher the cost of equipment.Due to the objective existence of thermal boundary layer on surface of chip or heat sink,a certain thermal resistance will be generated between the surface of chip case and the air outside the thermal boundary layer,thus the operation temperature provided by chip manufacture must be lower than the case temperature.From several aspects,this paper introduces the effective method of obtaining temperature of ambient and temperature of case.