摘要
基于微机电系统技术,在柔性聚酰亚胺(PI)基底上分别制作弓形与蛇形两种结构的铜薄膜与铂薄膜温度传感器。采用红外成像设备对传感器在通电状态下的热分布进行测试,结果表明PI基底具有良好的热绝缘性。对不同结构、不同金属薄膜的传感器性能进行对比分析,在25～90℃的温度测试范围内,4种温度传感器均具有较好的灵敏度和线性度,其中蛇形结构的铂薄膜温度传感器的线性度最好,线性相关系数达到了0.99933,其电阻温度系数为0.002 35/℃。
Copper and platinum film temperature sensors with bow and serpentine structures were fabricated on flexible polyimide(PI)substrates based on miroelectromechanical systems(MEMS)technology.The thermal distribution of the temperature sensor applied a direct current was tested by an infrared imaging device,and the results indicated that the PI substrate offered an excellent thermal insulation.The performance of the temperature sensors with different structures and different metal films was compared and analyzed.In the temperature range of25~90℃,all four flexible temperature sensors had good sensitivity and linearity.The Pt film temperature sensor with a serpentine structure exhibited the best linearity with a linear correlation coefficient of0.99933,and its temperature coefficient of resistance was0.00235/℃.
作者
何柳丰
窦文堃
刘军山
HE Liu-feng;DOU Wen-kun;LIU Jun-shan(Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116024,China)
出处
《机电工程技术》
2018年第11期5-8,80,共5页
Mechanical & Electrical Engineering Technology
基金
国家自然科学基金资助项目(编号:51475080
51621064)
