电镀级ABS树脂研制

Development of plating grade ABS resin

针对电镀级丙烯腈-丁二烯-苯乙烯共聚物(ABS树脂)开发技术要点,制备出电镀级ABS树脂,考察了橡胶含量、苯乙烯-丙烯腈共聚物(SAN树脂)中丙烯腈含量及助剂加入量等因素对产品性能的影响。结果表明,随着橡胶含量的增加,ABS树脂经过电镀粗化工艺后,制品表面凹坑数目及尺寸逐渐增加,橡胶的质量分数宜控制在15.0%～18.0%之间;增加硬脂酸镁添加量可降低ABS树脂产品加工过程表观黏度,减小制品内应力;提高SAN树脂中丙烯腈含量,有利于增强电镀层结合力。

In this study,the effects of rubber content,acrylonitrile content in acrylonitrile styrene copolyme(SAN resin)and amount of additives on the performance of electroplating grade acrylonitrile butadiene styrene copolymer(ABS resin)were investigated.Based on the above results,the plating grade ABS resin is attainable.With the increase of rubber content,the number and size of pits on the surface of products increased gradually after electroplating,and the rubber content was controlled in the range of15.0%~18.0%.The apparent viscosity and the inner-stress of ABS resin can be reduced by increasing the amount of magnesium stearate.Further more,the increase in acrylonitrile content of SAN resin can enhance the coating adhesion of ABS resin.