摘要
研究了不同表面改性方法(包括水热处理、溶剂热处理以及这两种方法的联合处理)对聚酰亚胺(PI)薄膜的微观结构、亲水性及与硅树脂涂层之间的结合力的影响。得到最佳表面改性工艺为:先采用0.1 mol/L NaOH水溶液在120°C下热处理1 h,再采用γ-氨丙基三乙氧基硅烷(KH-550)-乙醇(体积比1∶4)混合液在180°C下热处理1 h。经上述工艺改性后,PI薄膜的水接触角为40.3°,表面呈均匀的粗糙结构,硅树脂涂层在其上的附着力达到1级。
The effects of different surface modification methods including hydrothermal treatment,solvothermal treatment,and their combination on the microstructure and hydrophilicity of polyimide(PI)thin film and the adhesion of silicone resin coating on it were studied.The optimal surface modification process was determined as follows:hydrothermal treatment with0.1mol/L NaOH solution at120℃for1h followed by solvothermal treatment in a solution composed of(3-aminopropyl)-triethoxysilane(KH-550)and ethanol with a volume ratio of1:4at180℃for1h.The PI thin film modified thereby featured a water contact angle of40.3°and a uniformly rough surface on which a silicon resin coating had a1-grade adhesion.
作者
陈琴
张兴华
周超
杨传忠
冯锦
CHEN Qin;ZHANG Xing-hua;ZHOU Chao;YANG Chuan-zhong;FENG Jin(School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006,China)
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2018年第23期1080-1084,共5页
Electroplating & Finishing
关键词
聚酰亚胺薄膜
水热处理
溶剂热处理
微观结构
亲水性
硅树脂
附着力
polyimide film
hydrothermal treatment
solvothermal treatment
microstructure
hydrophilicity
silicon resin
adhesion