一种添加氧化石墨烯的高导热环氧型覆铜板

A high thermal conductivity epoxy type Copper Clad Laminate with graphene oxide

介绍添加氧化石墨烯的高导热环氧型覆铜板制备过程及其性能测试。这种板材绝缘电阻高、散热快等优点,更加适应于大功率多层PCB的需要,是一种很有发展前途的板材。

This paper introduced in detail about the manufacturing process of high thermal conductivity for FR-4copper clad laminate and relative functional test.This material has higher insulated resistance,higher thermal conductivity and etc.which can be fit for great power MLB requirement.It is a kind of new material developed.