高纵横比盲孔电镀铜填孔技术改进

Improvement of copper electro-filling in blind via with high aspect ratio

随着盲孔填孔产品及工艺的发展,越来越多的注意力被放在了高纵横比微盲孔的填孔技术开发上。目前高纵横比微盲孔填孔中经常出现包芯,面铜厚等问题。本文研究了通过特殊的分子结构设计以及工艺改进,极大的改善了高纵横比微盲孔的填孔表现。

With the development of additives and technology used in micro-via filling,much more attention was paid on filling blind via with high aspect ratio(AR>0.8).Now there were many problems in via filling with high aspect ratio,such as void and thick surface copper layer.In this paper,some specific molecular structure design and modification of technology were studied,aiming to improve the performance on filling blind via with high aspect ratio.