爆炸压实/扩散烧结法制备钨铜梯度材料

Explosive compaction-sintering of tungsten/copper gradient material

采用爆炸压实/扩散烧结方法成功制备出高致密度的钨铜梯度材料。首先,使用机械合金化法分别制备50%W-50%Cu,75%W-25%Cu的钨铜合金粉末,并将两种合金粉末依次铺在铜板表面进行预压、通氢烧结,然后进行爆炸压实,最后对爆炸压实后的试件进行扩散烧结,得到高致密度且层间结合紧密的钨铜梯度材料。对样品分析表明,铜在钨铜颗粒间的交界面处富集,其中50%W-50%Cu层中的钨颗粒未发生长大,75%W-25%Cu层中钨与铜出现了在局部区域富集的情况,钨铜层中钨铜的含量与起始加入的钨铜粉末配比保持一致。对各钨铜层进行孔隙度检测可见,50%W-50%Cu层的孔隙度为0.04%,75%W-25%Cu层的孔隙度为0.11%。钨铜层的硬度也呈现出梯度变化,维氏硬度值在125～341之间,远大于铜基体的50。

In this study we investigated the explosive compaction-sintering for fabricating a high-density tungsten/copper alloy on a copper surface.First,50%W-50%Cu tungsten/copper alloy powder and75%W-25%Cu were prepared by mechanical alloying.Next,the alloy powders were pre-compacted and sintered in hydrogen atmosphere,followed by explosive compaction.Then,a high-density tungsten/copper gradient material was obtained with the coatings and the matrix tightly bonded and the copper enriched at the interfaces between the tungsten/copper particles.The tungsten grains in the50%W-50%Cu layer did not grow,and in the75%W-25%Cu layer the tungsten and copper were enriched in local regions.Porosity tests were carried out,the porosity of the50%W-50%Cu layer was0.04%,and that of the75%W-25%Cu layer was0.11%.The contents of tungsten and copper in the coatings were similar to the added ratio of the tungsten powder and copper powder.The hardness of the tungsten/copper gradient layer exhibited a tendency of gradient change,varying between125-341,much bigger than50,that of the copper.