不同处理方式的光固化复合树脂充填体表面托槽黏结效果比较分析

Comparison of bonding brackets on different surface treatments method of light-cured composite resin surface

目的评价3种不同表面处理方式的光固化复合树脂表面黏结托槽的效果及机制,为临床应用提供实验参考依据。方法将33个3M光固化复合树脂面分为3组(每组11个),分别进行打磨粗糙(A组)、35%磷酸酸蚀(B组)、打磨粗糙+35%磷酸酸蚀(C组)。用扫描电镜观察不同表面处理后树脂面的显微结构改变。用3M TransbondTM光固化黏结剂黏结金属托槽,进行抗剪切强度测试,并测评光固化树脂面黏结剂残留指数(ARI积分)。结果不同表面处理方式的光固化复合树脂产生的抗剪切强度分别为:A组(8. 232±0. 340)MPa,B组(6. 964±0. 501) MPa,C组(12. 458±0. 882) MPa,差异有统计学意义(P <0. 05)。3组的ARI积分差别无统计学意义(P> 0. 05)。扫描电镜可见35%磷酸处理的树脂面表面结构变化不大;而打磨粗糙组和打磨粗糙+酸蚀组的树脂表面可见裂隙及空洞样改变,但两者差别不明显。结论在经过打磨粗糙+酸蚀处理的光固化复合树脂表面黏结托黏结效果最佳。

Objective To study the effect and mechanisms of bonding brackets on 3 different surface treatments method of light-cured compositeresin surface and to provide a reference for clinical applications.Methods Thirty-three light-cured composite resin surface were divided into 3 surface treatment groups(A,B,C groups)and were treated with rough polishing,35%phosphoric acid etching,and rough polishing+35%phosphoric acid etching.Changes of the resin surface microstructure after different surface treatment was observed by scanning electron microscope.Orthodontic brackets were bonded by 3M Transbond TM light-cured adhesives.The shear bond strength of all specimens was tested and the adhesive remnant index(ARI)was measured.Results The shear bond strength in 3 groups were A group(8.232±0.340)MPa;B group(6.964±0.501)MPa;and C group(12.458±0.882)MPa,respectively.The difference was statistically significant(P<0.05).The difference of ARI among 3 groups was not statistically significant(P>0.05).Scanning electron microscope study revealed the resin surface structure of acid etching were basically no change,while the surface treatment effect of rough polishing group and rough polishing+acid etching group was similar,both resin surface had shallow crack and porosity.Conclusion The bonding effect of rough polishing group and acid etching group is the best while adhering brackets to surface of light-cured adhesives.