表面处理工艺对基板表面金属元素电化学迁移的影响分析

Influence of surface treatment process on electrochemical migration of metal elements on substrate surface

本文通过滴水试验的方式,分析表面处理工艺对树脂基板、陶瓷基板对基板表面化学迁移的影响。在经过有机保焊膜和表面处理后,电化学迁移与经典化学迁移模型保持一致。在金属表面处理中,采用化学镍金表面处理后,可以呈现阳极晶枝生长,采用化学镍金表面处理后,陶瓷基板对电化学迁移的抵抗力最好。

In this paper,the effect of surface treatment on the chemical migration of resin substrate and ceramic substrate on the surface of the substrate was analyzed by means of drip test.Electrochemical migration is consistent with classical chemical migration models after organic solder masking and surface treatment.In the metal surface treatment,after the surface treatment with chemical nickel gold,the anode crystal growth can be exhibited.After the surface treatment with chemical nickel gold,the ceramic substrate has the best resistance to electrochemical migration.