微器件形状对液桥自组装能力的影响

Influence of micro-device shape on self-assembly ability using liquid bridge

利用液体表面张力进行微器件组装的技术在微电子机械和电子制造领域被广泛使用.因为液体表面张力和表面形态在组装过程中变化的复杂性,目前缺乏通用的解析方法来计算液桥力.本文以常见形状的组装器件为研究对象,基于Surface Evolver有限元分析软件建立液桥的仿真模型,通过仿真计算得到液桥的能量和受力,分析器件相对装配基底发生水平错动时作用在微器件上的回复力的变化规律,研究不同形状器件对回复力的影响,并阐述影响液桥组装能力的物理本质,为微器件的装配技术提供理论依据.

The liquid surface tension is widely used to assemble micro device in the fields of microelectronics and electronics manufacturing.Because of the complexity of liquid surface tension and surface morphology during assembly,there is no general analytical method for calculating liquid bridge forces.In this paper,the micro-devices with common shape are studied.Based on finite element analysis method,the simulation model of the liquid bridge is established by Surface Evolver.The changes in energy and force of the liquid bridge are obtained and analyzed when there is horizontal displacement between the device and the assembly substrate.The influence of the different shape on the restoring force is discussed,and the physical essence of the influence on the assembly ability of liquid bridge is expounded,which provides a theoretical basis for the assembly technology of the micro device.