聚合物基热界面材料的研究现状

Research status of polymer-based thermal interface materials

热界面材料可以有效地改善两个固体界面间的热传导,对于电子器件的性能、寿命和稳定性起着至关重要的作用。近年来,小型化、集成化已经成为电子器件的发展趋势,电子器件的功耗不断提升,所产生的热量越来越高,对热管理提出了更高的要求,所以,热界面材料的创新与优化也备受关注。因此,综述了热界面材料的研究进展,包括导热填料的种类、填充量和性质对于复合材料性能的影响,特别介绍了复合材料中导热填料链状及网状结构制备,包括模板法制备填料导热网络、静电纺丝构建链状填料、外加电磁场控制填料的取向。最后总结了现阶段热界面材料研究的问题,展望了未来热界面材料的研究方向。

Thermal interface material can effectively improve heat transfer between two solid interfaces,and it plays an important role in the performance,service life and stability of electronic devices.In recent years,miniaturization and integration have become the development trends of electronic devices.With the power of electronic devices continuing to increase,the amount of heat generated is sharply increasing.In this case,higher requirements are put forward for thermal management,so much attention is also attached to the innovation and optimization of thermal interface materials.Therefore,the research progress of thermal interface materials is reviewed.It is discussed for the effect of thermal conductive fillers on the properties of composites.In particular,it is introduced for the formation of thermal conductive chain or network by the methods of controlling the fillers in composites,including template method,electrospinning and external electric field or magnetic field.Finally,the problems are also discussed and the research directions of thermal interface materials in the future are prospected.