叠层双面冷却功率模块封装性能研究

Packaging performance of laminated double-sided power module

随着电力电子系统的功率密度、工作频率不断提升,传统封装功率模块的散热性能、电磁性能已无法满足系统的要求。为了使功率模块满足小型化、轻量化、高频化的使用要求,本文设计了一款基于功率芯片叠层的双面冷却功率模块。利用验证过的仿真方法,分别对650V/600A传统封装功率模块和叠层双面冷却功率模块进行了热阻仿真和杂散电感提取。结果表明:与同等规格的传统封装相比,叠层双面冷却功率模块体积减小了93.6%;热阻约为0.039℃/W,与传统封装相比减小了约50.6%;同规格传统封装的杂散电感约20.6nH,而叠层双面冷却功率模块的杂散电感仅为7.8nH,降低了约62%。

As the power density and working frequency of power electronic system increase,the heat dissipation and electromagnetic performance of traditional power module packaging cannot meet the requirements of the power system.To meet the practical needs of miniaturization,lightweight and high-frequency of power module,a double-sided cooling power module,based on power chip lamination,was designed in this work.Using validated method,the traditional packaging and laminated double-sided cooling power module of 650 V/600 A were simulated for thermal resistance and parasitic inductance extraction.The results indicate that the volume of the double-side cooling power module is reduced by 93.6%from the traditional packaging of the same specification.The thermal resistance of laminated double-sided cooling power module is about 0.039℃/W,which is reduced by 50.6%from the traditional packaging.The parasitic inductance of the traditional packaging is about 20.6 nH,while the stray inductance of laminated double-sided cooling power module is only 7.8nH,which is decreased by about 62%.