PCB板焊点识别方法研究

Algorithms of Identificating Solder Joints on PCB

PCB板进行故障检测的重要前提是对于待检测焊点的精确识别。目前国内外关于PCB板焊点识别方法的研究相对较少,由于PCB板焊点个数多,分布密集,直接采用图像识别算法如颜色匹配进行焊点识别,难度大且精度低。本文提出了一种新的基于模板匹配和坐标解耦算法相结合的焊点识别方法,识别精度高,且实际应用方便。

The important premise of the fault detection of PCB is the accurate identification of the solder joints to be tested. At present, there are relatively few researches on identification methods of solder joints at home and abroad. Because of the large number and dense distribution of solder joints, it is difficult to recognize solder joints directly by image recognition algorithms such as color matching.This paper proposes a new method of solder joints identification based on template matching and coordinate decoupling algorithm, which has high recognition accuracy and practical application.