平基底DIP元件波峰焊气孔不良的研究

Study on Flat Base DIP-component Blowhole in Wave Soldering

波峰焊气孔问题是较严重的质量问题,该缺陷一般处于钎缝的内部,但经加工后会暴露于钎缝表面,并因而对组件的密封性、导电性和抗腐蚀性等带来不利影响。一般情况下焊点表面光滑,结晶细密,无针孔,否则称之为气孔不良。通过分析平基底DIP元件波峰焊气孔不良的一个典型案例,找出该类元件在波峰焊后出现气孔不良的根本原因和有效改善方法。通过在基座增加脚垫、凹槽或垫板的工艺方法可改善平基底DIP元件波峰焊气孔不良问题和透锡不良问题。

Blowhole in wave solder process is a serious quality problem. The defect is usually located in the joint, but it will be exposed to the surface of the joint after processing, which will have adverse effects on the sealing, conductivity and corrosion resistance of the assembly. In general, solder joints are smooth, crystalline, and without pinholes, otherwise they are called blowhole defect. The root reason and effective improvement method of the element were found by analyzing a typical case of blowhole defect of flat base DIP-component with wave soldering. Adding pads or grooves under the base can solve the problems of blowhole and poor solder fill in through hole.