高Q值铜内电极MLCC烧结工艺研究

Study on Sintering Process of High Q Copper Internal Electrode MLCC

提出了一种高Q值铜内电极多层陶瓷电容器(MLCC)的烧结工艺。研究了烧结工艺中烧结温度、保温时间以及烧结环境对高Q值铜内电极MLCC的损耗和绝缘性能的影响,结果发现,合适的烧结温度可以使陶瓷晶粒生长充分,同时可以防止铜内电极出现挥铜现象。合适的保温时间可以在一定程度上改善瓷体颜色发白的现象。特殊的烧结环境可以使陶瓷芯片烧结更加致密,从根本上解决颜色发白的问题,从而解决铜内电极MLCC沉积后存在的损耗上升和绝缘性能下降的问题。

A sintering process of a high-Q copper internal electrode multilayer ceramic capacitor(MLCC) was proposed. The effects of sintering temperature, holding time and sintering environment on the loss angle and insulation performance of high-Q copper internal electrode MLCC were studied. It was found that suitable sintering temperature allows the ceramic grains to grow sufficiently and prevent copper internal electrode from oozing out; The proper holding time can improve the color whitening of ceramic chips to some extent; The special sintering environment can make the ceramic chip more compact, and fundamentally solve the problem of color whitishness, thereby solving the problem of loss rise and insulation performance decline after deposition of the copper internal electrode MLCC.