锡膏应用可靠性研究

Reliability Research of Solder Paste Application

高压细间距BTC器件的使用,增加了锡膏残留引起产品漏电和打火的风险,对锡膏应用可靠性提出了挑战。通过设计试验板,模拟QFN等BTC器件焊接与老化环境,在线监测高压细间距引脚间的SIR来研究锡膏的可靠性。结果表明可有效筛选出匹配应用要求的锡膏。

With the application of high voltage fine pitch BTC component, the risk of electric leakage and arc-spark is increasing, which is generally caused by solder paste residue, and challenges the reliability of solder paste application. The solder paste reliability was studied by designing test boards, simulating the soldering and aging environment of BTC devices such as QFN, and on-line monitoring of SIR between high voltage fine pitch pins. The results show that the solder paste can be effectively screen out to match application requirements.