电子封装行业的快速发展对专业人才培养的挑战

Challenge on the professional education from the rapid growth in electronic packaging

电子封装技术是教育部近年来开设的电子信息类特设专业,用于培养电子封装制造与测试等方面的工程应用型本科人才。本文首先分析了电子封装专业的特点,包括开设学校少、课程体系不合理、技术更新迭代快,更高的工程应用能力等。作者从师资队伍和课程实践两方面提出了专业电子技术专业所面临的挑战。

Major on electronic packaging is the special designed major on electronic information from Ministry of Education.It was used to train the undergraduate students in the field of electronic packaging related manufacturing and testing.This paper firstly studied the characteristics on the major of electronic packaging,which include less universities with the major,unreasonable curricula system,rapid growth on the packaging techniques and higher capability of engineering solution.The authors suggested the possible challenges on the major from teachers and practice training.