摘要
本文归纳了碳化硼薄膜的主要特性以及近年来在功能陶瓷、热电元件等方面的广泛应用。总结了目前物理气相沉积(PVD)和化学气相沉积(CVD)技术制备碳化硼薄膜的主要方法,包括磁控溅射法、离子束蒸镀法、经典化学气相沉积法(c-CVD)、等离子增强化学气相沉积法(PECVD、激光化学气相沉积法(LCVD)和热丝化学气相沉积法(HFCVD)等,讨论了各种沉积技术制备碳化硼薄膜工艺中各种实验参数对薄膜生长过程的影响,并对该领域今后的研究方向进行了展望。
This review summarized the characteristics of boron carbide films,and wide applications in functional ceramics,thermoelectric devices recently.The methods for the preparation of boron carbide films by physical vapor deposition(PVD)and chemical vapor deposition(CVD)techniques have been generalized,including magnetron sputtering,ion beam evaporation,classical chemical vapor deposition(c-CVD),and plasma enhanced chemical vapor deposition(PECVD),laser chemical vapor deposition(LCVD),and hot filament chemical vapor deposition(HFCVD).Finally,the effects of various experimental parameters on the growth process of thin films in preparation of boron carbide thin films by various preparation methods and prospect of applying in the functional materials have been discussed,respectively.
作者
涂溶
胡璇
章嵩
王传彬
沈强
张联盟
TU Rong;HU Xuan;ZHANG Song;WANG Chuan-Bin;SHEN Qiang;ZHANG Lian-Meng(State Key Laboratory of Advanced Technology for Materials Synthesis and Processing,Wuhan University of Technology,Wuhan 430070,China)
出处
《现代技术陶瓷》
CAS
2018年第6期417-431,共15页
Advanced Ceramics
关键词
碳化硼薄膜
物理气相沉积
化学气相沉积
Boron carbide films
Physical vapor deposition
Chemical vapor deposition