摘要
电子产品焊接后PCB板面残留不均匀、漏焊等异常现象,通常与波峰焊喷雾工艺相关,本文研究了波峰焊喷雾工艺,旨在找出喷雾均匀性的影响因素。通过实验验证分析,找出了其影响因素,并为电子波峰焊工艺技术提供强而有力的理论技术支撑。
After the welding of electronic products,there happens the nonuniform residues on PCB boards and missing weld phenomenon which are always related to spray welding process.The paper discusses the spray welding technology for wave soldering in order to find out the influencing factors of spray uniformity.Through experimental verification and analysis,the influencing factors are found out,and a strong technical theoretical support for electronic wave soldering process technology is provided.
出处
《日用电器》
2019年第1期37-40,共4页
ELECTRICAL APPLIANCES
关键词
波峰焊
助焊剂
喷雾
均匀性
wave soldering
flux
spray
uniformity
