微芯片爆炸箔起爆器及其平面高压开关研究进展

Review on Micro Chip Exploding Foil Initiator and Its Planar High-voltage Switch

爆炸箔起爆系统(Exploding Foil Initiator system,EFIs)的每一次技术升级都伴随着设计理念和制造工艺的革新,尤其是微机电系统(Micro Electro Mechanical System,MEMS)和低温共烧陶瓷(Low Temperature Co-fired Ceramics,LTCC)工艺,极大地促进了微芯片爆炸箔起爆系统(Micro Chip Exploding Foil Initiator system,McEFIs)的发展。简要分析了两种工艺制备微芯片爆炸箔起爆器(Micro Chip Exploding Foil Initiator,McEFI)的优缺点,列举了几种平面高压开关在电容放电单元(Capacitor Discharge Unit,CDU)中的工作性能,得出了开关的设计思路和研究方法的可行性。基于MEMS工艺和LTCC工艺制备及研究McEFI、平面高压开关和平面高压开关集成McEFI,分别总结了国内外的研究进展。提出了重点研究方向:深入研究MEMS工艺制备McEFI及其平面高压开关,以达到工程化应用;采用LTCC工艺,一体化烧结可制备具有独石结构的平面高压开关和McEFI。

Each technology upgrading of Exploding Foil Initiator system(EFIs)is accompanied with the innovation of design concepts and manufacture processes,especially the technologies of Micro Electro Mechanical System(MEMS)and Low Temperature Co-fired Ceramics(LTCC)greatly promote the development of Micro Chip Exploding Foil Initiator system(McEFIs).The advantages and disadvantages of Micro Chip Exploding Foil Iinitiator(McEFI)fabricated by two kinds of processes were briefly analyzed.The working performances of several planar high-voltage switches in Capacitor Ddischarge Unit(CDU)were listed,and the feasibility of manufacture idea and research method of the switch is obtained.The research progress at home and abroad based on the preparation of MEMS process and LTCC process,and the study of McEFI,planar high-voltage switch as well as planar high-voltage switch integrated with McEFI was summarized respectively.Key research directions were put forward.In-depth research of the fabrication of McEFI and its planar high-voltage switch by the MEMS process will achieve engineering application.The planar high-voltage switch&McEFI with monolithic structure can be fabricated by LTCC technology.