期刊文献+

柔性热管的研究进展与展望 被引量:2

Research Progress and Outlook of Flexible Heat Pipe
下载PDF
导出
摘要 现代电子设备的大功率化、高度集成化、微型化、柔性化发展趋势对先进的热管理材料和技术提出了迫切需求。基于气液相变的热管技术是一种高效的热管理手段,然而传统的刚性热管满足不了复杂结构、狭小空间的微型电子元器件以及可折叠电子器件的高性能散热需要,发展新型柔性热管技术有望克服上述问题,具有重要意义。系统介绍了柔性热管的基础理论、结构设计、材料加工、器件制备等方面的研究进展,以及其在航空航天、电子产品等领域的实际应用。基于柔性热管的发展历程和研究现状,对该领域今后的研究和发展方向做出了展望。 The rapid development of modern electronics towards high power density,miniaturization and high integration raises more urgent requirement on exploring advanced thermal management materials and technologies.Based on vapor-liquid phase change heat transfer,heat pipe technology is an effective tool for thermal management.Conventional rigid heat pipes,however,cannot meet the thermal management needs for microelectronics with complex structure and small space.Thus,the development of flexible heat pipe technology,which has the potential to overcome the shortcomings of rigid heat pipes,carries important technological significance.This paper presents a systematic review of the recent progress in fundamental theory,structure design,materials processing and device fabrication technologies of flexible heat pipes,and introduces their applications in aerospace and electronic products.Based on the development history and current status,we provide an outlook on the research and development of flexible heat pipes in the future.
作者 陶鹏 常超 郭怀新 陈寰贝 尚文 邓涛 TAO Peng;CHANG Chao;GUO Huaixin;CHEN Huanbei;SHANG Wen;DENG Tao(State Key Laboratory of Metal Matrix Composites,School of Materials Science and Engineering,Shanghai Jiao Tong University,Shanghai 200240,China;Science and Technology on Monolithic Integrated Circuits and Modules Laboratory,Nanjing Electronic Devices Institute,Nanjing 210016,China;Nanjing Electronic Devices Institute,Nanjing 210016,China)
出处 《中国材料进展》 CAS CSCD 北大核心 2018年第12期1025-1032,1047,共9页 Materials China
基金 国家重点研发计划项目(2017YFB0406100) 微波毫米波单片集成和模块电路重点实验室开放基金项目(614280303020217)
关键词 柔性热管 气液相变 热阻 导热率 flexible heat pipe vapor-liquid phase change thermal resistance thermal conductivity
  • 相关文献

参考文献1

二级参考文献38

  • 1白穜,张红,许辉.新型组合式吸液芯高温热管传热性能试验研究[J].热力发电,2013,42(5):59-63. 被引量:3
  • 2吴红刚,王文,李庆友.一种芯片散热型热管的强化传热研究[J].科学技术与工程,2006,6(11):1474-1478. 被引量:3
  • 3周建辉,杨春信.CPU散热器热分析与优化设计[J].现代电子技术,2006,29(18):1-4. 被引量:11
  • 4杨洪武.微槽群集成热管散热器:中国,200620115025[P].2007-04-04.
  • 5McGlen R J, JachuckR, LinS. Integrated thermal management techniques for high power electronic devices[J]. Applied Thermal Engineering, 2004, 24: 1143-1156.
  • 6Garimella S V. Advances in mesoscale thermal management technologies for microelectronics[J]. Microelectronics Journal, 2006, 37 (11); 1165-1185.
  • 7Vasiliev L L. Micro and miniature heat pipes electronic component coolers[J]. Applied Thermal Engineering, 2008, 28: 266-273.
  • 8Possamai F C, Setter I, et al. Micro and miniature heat pipes electronic component coolers[J]. Applied Thermal Engineering, 2009, 29." 3218-3223.
  • 9Singh R, Akbarzadeh A, Dixon C, et al. Miniature loop heat pipe with fiat evaporator for cooling computer CPU[J]. Components and Packaging Technologies, IEEE Transactions on, 2007, 30 (1) : 42-49.
  • 10Li Ji, Wang D, Peterson G P. A compact loop heat pipe with fiat square evaporator for high power chip cooling[J]. Components, Packaging and Manufacturing Technology, 1EEE Transactions on, 2011, 1 (4) .. 519-527.

共引文献31

同被引文献44

引证文献2

二级引证文献11

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部