基于原位体积加成制备导电线路的研究

Preparation of Conductive Circuits Based on the Volume Additive in-situ

本文提出一种制备导电电路的方法。以纳米铜为导电填料,以光固化树脂为连接剂,制备含铜光固化油墨,利用丝网印刷方法获得含有纳米铜的图案,利用铜与银盐间的置换反应,将铜纳米粒子图案通过原位体积加成转化为导电银图案。研究结果表明,铜图案不具有导电性,而置换反应生成的银图案具有导电性,且导电能力受铜含量、银盐浓度、光照时间、浸泡反应时间等因素影响,本实验中获得的最高电导率为1.25×105 S/m,导电线路具有良好的耐弯曲、耐疲劳性能,同时兼具优异的可修复性能,为导电线路的制备提供了常温下简单有效、成本低廉的实现方法,具有重要的参考价值。

This research provide a method for preparing conductive circuits.Nano copper powders were used as conductive filler and photo-curable resin were used as linking agent to prepare copper-containing photo-curing ink.The copper nano particles were patterned by screen printing method.Then,the copper nano particle patterns were converted to silver pattern by in-situ volume addition.The results showed that the printed copper patterns were not conductive,the silver patterns generated by the in-situ replacement reaction were conductive.The copper content,silver salt concentration,irradiation times,reaction times had a relationship with the conductive ability.In this experiment,We have got circuits whose conductivity is 1.25×10^5 S/m.The conductive circuits have good bending character,good fatigue performance and repairable performance at the same time.This research provide a simple and cheep method for preparation of conductive circuits in room temperature.