厚金镀层上In60Pb40焊料焊接分立器件研究

Study of Discrete Device Using In60Pb40 Solder To Thick Au Metallizations

针对厚金镀层中使用Sn62Pb36Ag2合金焊料焊接分立器件容易出现焊点不良的问题,使用In60Pb40合金焊料进行厚金镀层的焊接实验。研究In60Pb40合金焊料焊接后的焊点外观、焊接强度,并对老化前后金属间化合物厚度及成分进行了分析。研究结果表明,铟-铅合金焊料的焊接外观比锡-铅共晶焊料更好,形成的IMC层对金在焊接层中的扩散具有很好的抑制作用。

In order to solve the problem of incompetent welding which discrete devices using Sn62Pb36Ag2 alloy solder to the thick Au metallizations,this time use In60Pb40 solder to do the experiment of soldering to the thick Au metallizations.The samples of In60Pb40 alloy solder used for researching on the solder welding appearance.The thickness and composition of intermetallics before and after aging were also analyzed.The results show that the welding appearance of indium-lead alloy solder is better than that of tin-lead eutectic solder,and the IMC layer formed has a good inhibition effect on the diffusion of gold in the welding layer.