回流焊接温度曲线的拟合研究

Analysis of the Fitting of Reflow Soldering Temperature Curve

在SMT回流焊接过程中,影响焊接质量的因素很多,而锡膏供应商提供的回流焊温度曲线是在出厂条件下测试的,对于生产者来说借鉴价值不高。本文分析了影响回流焊质量的各方面因素,并优化了回流焊温度曲线。

In the SMT reflow soldering process, there are many factors affecting the soldering quality, and the reflow soldering temperature curve provided by the solder paste supplier is tested under the factory conditions, and the refer. ence value for the producer is not high. This paper analyzed various factors affecting the quality of reflow soldering and optimized the reflow soldering temperature profile.