摘要
探讨穿透型、非穿透型和场截止型三种结构的IGBT的特性、制作过程以及这些工艺过程对相应参数的影响,详细论述一些常用概念如穿透、透明集电极的含义,列出最新的沟槽场截止型IGBT的优点和发展趋势。分析了IGBT的电流IC的定义方法,是基于芯片的结温、热阻和饱和导通压降UCES的计算值。系统阐述设计电焊机时如何选取IGBT参数,以及IGBT在开关过程中跨越正温度系数和负温度系数区产生动态均流问题,并给出相应解决方法。
The features and process of three kinds of IGBT structures such as Punch Through,Non Punch Through and Field Stop are discussed in this paper.The effect of different structures on the parameters is also talked.Some principles such as punch through and transparent collector are clarified.The latest trench field stop structure and development trend are presented.The calculation method to define the current rating of IGBT IC is analyzed based on the maximum die junction temperature and thermal resistance.The total procedure to select the key parameters of IGBT in welding machine is given.The dynamic current imbalance between positive and negative thermal coefficient during the switching process is discussed and the solution is also given in the end.
作者
刘松
LIU Song(Alpha&Omega Semiconductor,Co.,Ltd.,Shanghai 200070,China)
出处
《电焊机》
2019年第1期36-40,84,共6页
Electric Welding Machine
关键词
穿透型
非穿透型
场截止型
沟槽
均流
punch through
non punch through
field stop
trench
current balance