对大功率LED车灯芯片结温部分关键影响因素的研究

Research on the Partial Key Factors Affecting the Junction Temperature of High Power LED Lamp Chip

针对LED车灯芯片照明过程中结温过高的问题,文中对影响芯片结温高低的两种关键因素:LED车灯芯片内部发光源间距和芯片排布间距进行研究,以求有效降低芯片结温。通过ANSYS Workbench16.0软件进行芯片热仿真模拟,随后利用恒温测试平台对仿真结果可靠性进行了验证。验证结果表明,合理设置LED车灯芯片内部发光源之间的间距能有效降低芯片结温,最高可降低8.249℃;同时,适当增加LED车灯芯片之间排布间距亦可有效降低结温0.5℃。

Due to the problem of high junction temperature during the lighting of LED lamp chips,two key factors affecting the junction temperature:distance between the light sources in the LED lamp chip and the spacing between the chips were studied in order to effectively reduce the junction temperature of the chip.This paper used ANSYS Workbench16.0 software for chip thermal simulation and verified the reliability of simulation results by the constant temperature test platform.The simulation results showed that properly setting the spacing between the internal light sources of the LED lamp chip could effectively reduce the chip junction temperature by 8.249℃while appropriately increasing the spacing between LED lamp chips could also effectively reduce the junction temperature by 0.5℃.