摘要
金属基板压合工艺采用不流胶半固化片将PCB与铜基热压黏结成金属基PCB。本文主要从槽位流胶、金面变色氧化、压合空洞、PCB板面凹陷、金属基与PCB尺寸匹配性和成品可靠性等方面研究,解决制造过程中的工艺难点,实现量产能力,提升良品率达95%。
Post-bonding metal-based PCB was manufactured by pressing the copper-base to PCB with noflow prepreg. Some new technologies were studied, such as eliminating the excessive resin flow in cavity area, the tarnishing of gold plating and oxidation in edge area, the void, the cavity and the delamination of intensive holes area, size matching between metal-base and PCB, and so on. The volume-production was realized by solvingthese process problems.
作者
杜红兵
纪成光
陈正清
Du Hongbing;Ji Chengguang;Chen Zhengqing
出处
《印制电路信息》
2019年第2期34-41,共8页
Printed Circuit Information
关键词
压合金属基板
流胶改良
金面变色
压合空洞
板面凹陷
Post-Bonding Metal-Base PCB
Resin Flow Improvement
Tarnishing of Gold Plating
Void
Panel Cavity
