应变速率和电流处理对铜及铜合金电致塑性效应的影响

Effect of Strain Rate and Electric Current on Electroplastic Effect of Copper and Copper Alloy

通过改变脉冲电流输入参数以及拉伸应变速率系统考察了脉冲电流作用下不同层错能的纯铜及H62黄铜合金的电致塑性效应。借助INSTRON5969型电子万能试验和ULTRA PLUS型场发射扫描电镜(SEM)考察了脉冲电流作用下纯铜及H62黄铜合金的力学性能和断口形貌的演变。研究结果发现对于不同层错能的材料,施加电流对材料力学性能的影响不同;而力学性能的变化与材料自身物理性质有关,且在该实验条件下,应变速率和电流对纯铜及H62黄铜合金力学性能几乎没有影响。

By changing the electric current pulse parameters and the tensile strain rate, the electroplastic effects of copper and copper alloy with different stacking faults energy were investigated. To analyze the evolution of mechanical properties and fracture morphology, the INSTRON5969 electronic universal testing machine and ULTRA PLUS field emission scanning electron microscope (SEM) were used. The results showed that different influences could be detected due to the materials with different stacking faults energy during current passing. However, the materials mechanical property was controlled by the physical properties of materials. In addition, it was found that the strain rate and electric current had little effect on the electroplasticity of pure copper and H62 brass under the experimental conditions.