基于仿真分析的波峰焊接过程的研究

Research on Welding Soldering Process Based on Simulation Analysis

为实现波峰焊接过程的仿真分析,本文运用ANSYS/Fluent对THT元件波峰焊接过程进行研究,首次通过仿真手段实现了波峰焊接过程的模拟,建立了基于VOF、CSF、k-epsilon(2qn)方程和能量方程的THT元件波峰焊流固耦合分析模型。经过分析,发现THT元件波峰焊焊点的形成主要受焊盘的润湿力、钻孔和引脚间的毛细作用力以及附加内压的作用。焊接过程中,PCB板温度在厚度方向呈梯度分布,具体表现为由焊接面到元件面、孔内到孔外逐渐递减的趋势,与实际情况一致。

In order to realize simulation analysis during wave soldering process,this paper uses ANSYS/Fluent to study the wave soldering process of THT components.The simulation of the wave soldering process is realized by simulation method for the first time.Fluid-solid coupling analysis model of wave-welding of THT components based on VOF,CSF,k-epsilon(2qn)and energy equation is established.After analysis,it is found that the formation of the solder joints of the THT components is mainly affected by the wetting force of the pads,the capillary forces between the drill holes and the leads,and the additional internal pressure.During the soldering process,the PCB board temperature distribution is gradient in the thickness direction,which is manifested by the tendency of the soldering surface to the component surface,the hole to the outside of the hole to gradually decrease,which is consistent with the actual situation.