摘要
为实现整机电子产品快速制造与快速验证,从目前3D打印技术的发展现状来看,电子电路3D打印技术由于其技术难度较大而发展缓慢,已经成为制约电子产品实现快速制造的关键因素。研究了国内外电子电路3D打印技术的研究进展,分析了国内外存在的主要差距。结合军用整机电子装备对电子电路3D打印的需求和可靠性要求,展望了电子电路3D打印技术下一步的研究方向。
The development of 3D printing technology of electronic circuit has developed slowly because of its high diffi culty. It has become the key factor restricting the rapid manufacturing of electronic products. The 3D printing technology of electronic circuits at home and abroad is studied in order to realize rapid manufacturing and rapid verifi cation of electronic products. The research progress is analyzed, and the main difference between home and abroad are analyzed. Then, combined with the demand and reliability requirements of electronic equipment, the research direction of the next step of 3D printing technology for electronic circuit is prospected.
作者
杨伟
毛久兵
冯晓娟
杨平
杨剑
YANG Wei;MAO Jiubing;FENG Xiaojuan;YANG Ping;YANG Jian(The 30th Research Institute of CETC, Chengdu 610041, China)
出处
《电子工艺技术》
2019年第1期1-4,共4页
Electronics Process Technology
基金
武器装备联合基金项目(6141B08120301)
关键词
快速制造
快速验证
3D打印
电子电路
研究进展
rapid manufacturing
rapid verifi cation
3D printing
electronic circuit
research progress
