界面导热粘接材料粘接工艺研究

Bonding Technology of Thermal Conductive Adhesive at Interface

在电子装联过程中,高功率器件需要粘接散热器进行散热。通过设计一系列的粘接工艺实验,对粘接散热器工艺的影响因素进行分析。实验结果表明:粘接剂本身的内聚强度、散热器/芯片的表面处理和润湿性能以及工艺操作规范性是影响散热器粘接可靠性的三个主要因素。

The high power devices need to be bonded to radiator for heat dissipation in the process of electronic assembly. The factors influencing the bonding performance of radiator were analyzed based on designing a series of bonding process experiments. The experimental results show that the three main factors affecting the reliability of the radiator bonding are cohesive strength of the adhesives, surface treatment and wettability of the radiator/die, and standardization of operation.