用于微电子封装的电子胶粘剂及其涂覆工艺

Electronic Adhesive and Fluid Dispensing Technology for Micro-Electronics Packaging

介绍了电子胶粘剂及其涂覆工艺,其所涉及的工艺有大量式点胶(Mass Dispensing),接触式点胶(Contact Dispensing),非接触式点胶,总结了各种分配技术的优缺点,指出了不同分配技术的适用情况,提出电子胶粘剂涂覆工艺技术方案。

This paper introduces the electronic adhesives and their fluid dispensing technology. The technologies involved are Mass Dispensing, Contact Dispensing and Non-contact Dispensing. The advantages and disadvantages of various distribution technologies are summarized, the application of different distribution technologies is pointed out, and the fluid dispensing of electronic adhesives is put forward.