高导电三维打印石墨烯墨水的制备与性能研究

Highly conductive graphene ink and its application for three dimensional printing

当前利用三维打印技术(3DP)制备石墨烯器件时,通常采用的化学还原法由于常使用剧毒的强还原剂,生产过程危险性大,污染性强。相较而言,热还原法制作工艺简单,参数可控性强,更适合用于通过3DP技术制备高导电集成电路器件。采用还原氧化法来制备石墨烯,通过Hummers法氧化石墨单质合成氧化石墨烯(GO),以GO作为基底材料,加入一定比例的黏结剂、分散剂等添加剂来配制可用于3DP的GO墨水。选择3DP中简单可控的直写成型(DIW)工艺来打印导电线路,并将导线置于氩气环境下的管式炉中,分别在200,500和800℃的温度中进行烧结还原,经过800℃热还原的还原氧化石墨烯(rGO),其方阻可降低至200 mΩ/以下。试验测试分析表明,配制的GO墨水可用于三维打印导电线路,且经烧结热还原后得到高电导率的rGO电子器件。

Study of reduced graphene oxide(rGO)ink for three-dimensional printing(3DP)application encounters a major barrier that the traditional chemical reduction technique process is usually dangerous and polluting owing to the use of highly toxic strong reductants.Instead of chemical reduction technique,thermal reduction for rGO ink preparation were used and graphene conductive wire was fabricated by 3DP technique.Graphene was prepared via reduction of the graphene oxide(GO)which was synthesized by Hummers’method.A certain proportion of additives such as binder and dispersant were added to prepare GO ink for three-dimensional printing(3DP).Conductive wires were printed by using the GO ink via direct-write molding process.Then,the wires were inserted into a tube furnace in argon atmosphere for thermal reduction at 200,500 and 800℃,respectively.The results shows that,the sheet resistance of the rGO by using thermal reduction at 800℃can achieve as low as 200 mΩ/.Thus,the prepared GO ink can be used for 3DP process of conductive wires and highly conductive electronic devices fabrication by thermal reduction.