碲锌镉衬底国产研磨料的研究

The Research on the Domestic Abrasives Used for the Lapping of CdZnTe Crystals

针对原有国产碲锌镉衬底加工磨料粒度分布不均匀、存在异常大颗粒等问题,根据重力沉降原理,对国产磨料进行分级处理,将分级处理后的国产L、M类磨料与进口Logitech磨料进行磨抛对比实验,结果表明:与进口磨料相比,国产-M磨料去除速率大约提高了27%,研磨后晶片表面波纹度Wa值和凹坑面积占比降低,晶片表面质量提高,可替代进口的Logitech磨料。

According to the gravity sedimentation principle, the domestic abrasives are classified according to the gravity sedimentation principle, and the domestically produced L--M abrasives and imported Logitech are processed according to the principle of gravity sedimentation. The abrasives were subjected to grinding and polishing comparison experiments. The results showed that compared with imported abrasives, the removal rate of domestic-M abrasives was increased by about 27%. After grinding, the wafer surface waviness Wa value and the pit area ratio decreased, and the wafer surface quality improved. Replace imported Logitech abrasives.