小型变负荷冷却装置对高热流芯片散热的实验研究

Experimental study on cooling high heat flux chip with small variable load cooling device

针对一套变容量蒸汽制冷系统,设计制作了迷宫型蒸发冷板,并分别冷却100 W和200 W的模拟芯片,通过实验研究了不同充注量与压缩机转速的变化对系统的压力、温度、能效比的影响关系。实验表明:制冷剂充注量的增加和压缩机转速的上升都会使得系统的蒸发压力与吸排气温度有所提高,而充注量的提升会使制冷量与COP呈先升高后下降的走势,压缩机转速的上升则会改变制冷量上升的速率。最终确定当充注量为75 g、转速为4200 r/min时系统的性能较好,两组模拟芯片的温度均保持在合理范围,此时系统COP为3.17。

A variable speed vapor compression cooling device and a spiral evaporative cooling plate were used to cool analog chips which were 100 W and 200 W. The influence of different charging rate and compressor speed on the system pressure, temperature, refrigeration effect and energy efficiency ratio was studied experimentally. The experiment showed that the increase of refrigerant charge and the increase of compressor speed would make the evaporation pressure and the suction and exhaust temperature of the system increase. The increase of charge volume would make the cooling capacity and COP first increase and then decrease, and the increase of compressor speed would change the rate of increase of refrigerating capacity. Finally, when the charge was 75 g and the speed was 4200 r/min, the performance of the system was better. The temperature of the two groups of analog chips was kept in a reasonable range, at this time the system COP was 3.17.