金属微通道散热器结构微电铸均匀性研究

Study on Micro-electroforming Uniformity of Metal Micro-Channel Radiator Structure

基于微电铸工艺,通过添加片外辅助阴极的方法制作一款金属微通道散热器。首先,利用Comsol有限元软件对微电铸过程中金属微通道散热器结构的铸层厚度分布进行模拟分析,同时通过仿真模拟的正交试验研究了不同参数下的片外辅助阴极对微通道铸层厚度均匀性的影响。仿真结果表明:采用正交试验的最优水平组合,即片外辅助阴极与阴极的水平距离为3 mm、片外辅助阴极的宽度为3 mm、施加在片外辅助阴极上的电流密度为1 A/dm^2时,电沉积10 h后的微通道铸层厚度均匀性提高了27.5%,这与实验结果基本相符。经过10 h的连续电铸实验,添加最优片外辅助阴极后的铸层厚度均匀性提高了54.2%。

Based on micro-electroforming technology,the structure of a metal micro-channel radiator has been fabricated by adding a secondary cathode. Firstly,the electroforming layer thickness distribution of the metal micro-channel radiator structure was simulated and analyzed by the finite element analysis software Comsol. Then,in order to study the influence of the different secondary cathode parameters on the thickness uniformity of the micro-channel electroforming layer,an orthogonal design of simulation was carried out. The simulation results showed that the best combination of experiment is a 3 mm horizontal distance between secondary cathode and cathode,a 3 mm width of secondary cathode and a current density applied to secondary cathode of 1 A/dm^2. The thickness uniformity of the micro-channel electroforming layer increased by 27.5% after 10 h electrodeposition,which reaches an agreement with the experimental results. After 10 h electroformation,the thickness uniformity of the electroforming layer increased by 54.2% under the best level combination.