铜箔电镀Cr-Zn-Ni防氧化工艺研究

Study on Anti Oxidation Process of Copper Foil Electroplating Cr-Zn-Ni

为提升铜箔的抗氧化性能,本文采用铬锌镍三元体系对铜箔进行电镀,研究主盐比例、电流密度对镀层的影响,确定主盐质量比为1∶4∶3,电流密度为30A/m^2时,镀层外观良好,170℃放置1h不变色。

In order to improve the oxidation resistance of copper foil, the copper foil was electroplated with a three element system of chromium, zinc and nickel. The influence of the proportion of main salt and current density on the coating was studied.The result showed that when the mass ratio of the main salt was 1∶4∶3 and the current density was 30A/m^2, the apparent good was fine, and can keep the color constant for 1 h at 170 ℃.