镍电极多层瓷介电容器烧结工艺的研究

Study on sintering process of BME-MLCC

通过对比试验,详细讨论了烧结工艺中烧结温度、氢气浓度、加湿器水温和再氧化空气流量对贱金属电极多层瓷介电容器(BME-MLCC)性能的影响。使用扫描电子显微镜(SEM)对烧结后瓷体形貌进行表征,并对制成的样品进行电性能分析。结果表明:烧结温度是影响样品介电常数和介质层致密性的重要因素。随着烧结温度的升高(1255～1285℃),样品介电常数先增大后减小,介质层更加致密。氢气浓度对样品绝缘电阻有较大影响,随着氢气浓度的增大(体积分数0.5%～1.5%),样品绝缘电阻先增大后减小。加湿器水温升高(35～45℃),样品绝缘电阻随之增大,损耗角正切降低。再氧化空气流量增大(5～15 mL/min),样品绝缘电阻增大,损耗角正切先减小后增大。

With contrast experiments, effects of sintering temperature, concentration of H 2 , water temperature of humidifier and flow of air on properties of BME-MLCC were described. The micro-morphology of samples was analyzed by scanning electronic microscope ( SEM) and the properties of MLCC samples were characterized. The main research contents and results are as follows: The main factor of dielectric constant and compactness is sintering temperature. As the sintering temperature rises from 1255 ℃ to 1285 ℃, the dielectric constant climbs up and then declines, the compactness of dielectric gets better at the same time. The concentration of H 2 has an effect on insulation resistance. As volume fraction of H2 rises from 0. 5% to 1. 5%, the insulation resistance climbs up and then declines. As the water temperature of humidifier rises from 35 ℃ to 45 ℃, the insulation resistance increases and the loss tangent reduces. As the flow of air increases from 5 mL / min to 15 mL / min, the loss tangent climbs up and then declines, and the insulation resistance increases.