电源模块水冷板的数值模拟及优化

Numerical Simulation and Optimization of Power Module Water-Cooling Plate

由于水的强制对流换热系数高达1500W/(m2·K),是气体强制对流换热系数的百倍以上,因此对于高功率密度电力电子设备,采用水冷的方式冷却效率更高[1]。另外,水冷板是目前优异的电力电子设备冷却技术,具有以下优点:结构简单、加工方便;温度梯度小、热量分布均匀、冷却效率高;间接冷却,设备可靠性高,冷却液污染小;热载荷范围广,能有效冷却高热流密度的电力电子设备[2]。该文以电源模块的水冷板为研究对象,通过对三种不同流道的水冷板的性能进行模拟分析,优选出更佳的水冷板方案,使充电电源散热性能更佳,效率更高。

Because the coefficients of forced convection heat transfer of water are as high as 1500 W/(m2 · K) and more than 100 times that of forced convection heat transfer of gas, the cooling efficiency of high power density power electronic equipment by water cooling is higher[1]. In addition, water-cooled plate is an excellent cooling technology for power and electronic equipment, which has the following advantages: simple structure, easy processing;small temperature gradient, uniform heat distribution, high cooling efficiency;indirect cooling, high reliability of equipment, low pollution of coolant;wide thermal load range, can effectively cool power and electricity with high heat flux density. The sub device[2]. In this paper, the water-cooled plate of the power module is taken as the research object. Through the simulation analysis of the performance of the water-cooled plate of three different runners, the better water-cooled plate scheme is selected to make the charging power supply have better heat dissipation performance and higher efficiency.