LED器件热管理分析方法及其应用

Thermal Management Analysis Method of LED Devices and Its Application

发光二极管(LEDs)是三明治结构的半导体材料。LED芯片是产生光和热量的核心功能器件,但累积的热量会严重影响LED的光学性能。因此,热管理在LED的封装和应用中十分重要。综述了一些现有的热故障。为了有助于进一步理解热管理,介绍了LED封装、热阻网络系统以及传热强化技术,以及通过降低热阻来实现有效温度控制的方法。

Light-emitting diodes (LEDs) are sandwiches of semiconductor materials.LED chips are the core and functional part that produce light and heat,but the accumulated heat negatively influences optical properties of LEDs.Thus thermal management plays an important role in LEDs packaging and applications.It can be seen that there exist a great number of heat troubles from this review.In order to further understand the thermal management,LED packaging,thermal resistance network system and heat transfer enhancement technology were systematically introduced.Effective temperature control was achieved by reducing the thermal resistance.