微流道模具掩模电解加工多场耦合数值模拟

Numeric Simulation of Mask Electrochemical Machining for Micro-channel Mold under Multi-physics Field Coupling

针对医用微流道模具掩膜电解加工技术难题,应用Comsol软件建立多物理场耦合有限元模型,计算得到微流道段内流速分布。通过分析电解液入口流速对氢气气泡率、铁离子浓度和温度的影响,进而分析对电解液电导率的影响。在相同加工参数下,宽500μm、深200μm沟槽尺寸和形状的计算模拟结果与实验结果基本吻合,其深度方向最大误差为10.07μm、相对误差为5.03%,可为微流道模具掩膜电解加工的流场控制提供数值计算和实验依据。

In view of the technical problem of mask electrochemical machining for medical microchannel mold mask,the multi-physics field coupling module based on Comsol software was used to establish a multi-physics field coupling finite element model,and then the distribution of flow velocity in the micro-channel was calculated. The influence of bubble rate of hydrogen,iron ion concentration and temperature on the electrolyte inlet flow rate were studied in order to analyze its influence on the conductivity of the electrolyte. The research shows that the simulated results of a micro-channel sample of 500μm width and 200μm depth reaches an agreement with the experimental results. The maximum and percentage error in the depth direction is 10.07μm and 5.03%,which provides a theoretical and experimental basis for flow field control of complex graphics mask electrochemical machining.