某吊舱液冷机箱结构及工艺设计

Structure and Process Design of a Liquid-cooled Chassis of a Pod

随着电子器件集成化、小型化的发展,电子设备封装密度增大、体积缩小,热流密度急剧增加。为了更好地实现电子器件的散热,目前大多数航空机箱均采用强迫液冷散热方式。文中以一种具有"蛇形水道"的某吊舱液冷机箱作为实例,从总体结构设计、水道成形方式及总体工艺方案三个方面论述了某吊舱液冷机箱的设计制造过程,并最终完成某吊舱液冷机箱的加工生产。

With the development of electronic devices integration and miniaturization, the packaging density of electronic devices has increased, the volume has decreased, and the heat flux density has increased dramatically. In order to better realize the heat dissipation of electronic devices, most aviation chassis currently use forced liquid cooling. Taking a liquid cooling chassis of a pod with a “snake water channel” as an example, the design and manufacturing process of a liquid cooling chassis of a pod is discussed from the overall structural design, water channel forming method and overall process plan. And finally the processing and production of a pod liquid cooling chassis is completed.