摘要
文中经过大量的工艺试验和产品验证,解决了塑封BGA器件焊接良率和可靠性的问题。随着金属封装BGA(CCGA)的应用,对金属BGA(CCGA)焊接桥连问题进行论述,针对印刷网板厚度及开口方式的改进,提出一些改善金属BGA(CCGA)焊接质量工艺方法,在实践中取得了良好效果。
After a large number of process tests and product verification, this paper solves the problem of welding yield and reliability of plastic BGA devices. With the application of metal package BGA (CCGA), the problem of metal BGA (CCGA) welding bridging is discussed. In view of the improvement of printing stencil thickness and opening mode, some methods to improve the quality of metal BGA (CCGA) welding are proposed. Good results have been achieved.
作者
黄丽娟
朱正虎
王民超
HUANG Lijuan;ZHU Zhenghu;WANG Minchao(Nanjing College of Information and Technology, Nanjing 210023, China;8511 Research Institute of CASIC, Nanjing 210007, China)
出处
《机械工程师》
2019年第4期163-165,共3页
Mechanical Engineer
