摘要
采用正交试验优化设计新型Sn-Bi-Ag-Cu-Ce五元无铅焊料,对焊料熔点、铺展系数及抗拉强度进行测试,通过方差分析确定五元无铅焊料的最佳配方,并对比分析最佳焊料的强度及润湿铺展性能。结果表明:Sn-Bi-Ag-Cu-Ce五元无铅焊料的熔点接近Sn-37Pb焊料,为203.4℃;焊料组织中的富Bi相、Ag3Sn相和Cu6Sn5相得到细化,焊料抗拉强度明显提高,达到56.3 MPa;焊料铺展系数相较SAC305、SAC0307焊料提高9.4%、13.8%。
The Sn-Bi-Ag-Cu-Ce five-element lead-free solder was optimized by orthogonal test.The melting point,spreading coefficient and tensile strength of the solder were tested.Then the best formula of the five-element alloy solder was obtained by variance analysis of the orthogonal test results.The performance of the best solder was analyzed and compared.The results show that Sn-Bi-Ag-Cu-Ce five-element lead-free solder has a melting point close to that of Sn-37 Pb solder,which is 203.4℃.The Bi-rich phase,Ag3Sn phase and Cu6Sn5 phase in the solder structure are refined,and the tensile strength of the solder is obviously improved,reaching 56.3 MPa.The solder spreading coefficient increases by 9.4%and 13.8%than that of SAC305 and SAC0307 solder,respectively.
作者
许国星
徐冬霞
王宗伟
王东斌
XU Guoxing;XU Dongxia;WANG Zongwei;WANG Dongbin(Department of Material Science and Engineering,Henan Polytechnic University,Jiaozuo 454003,China;Engineering Research Center for Structural and Functional Metal Matrix Composites in Henan Province,Jiaozuo 454003,China)
出处
《兵器材料科学与工程》
CAS
CSCD
北大核心
2019年第2期40-44,共5页
Ordnance Material Science and Engineering
基金
河南省科技攻关项目(142102210434)
河南省教育厅科学技术研究重点项目(15A430026)
关键词
焊料多元化
正交试验
方差分析
稀土元素
solder diversification
orthogonal test
variance analysis
rare earth element
