一种无卤无磷高耐热覆铜板的制备

Preparation of a halogen free and Non-phosphorus heat resistant CCL

随着环保的要求越来越严格,在覆铜板无卤化之后,又提出了无磷的要求。本文对瑞典的无卤无磷的新环保法案进行简介,并介绍无卤无磷型覆铜板的开发思路。所开发的无卤无磷型覆铜板满足瑞典新环保法案,阻燃性能好、高Tg、耐热性好、吸水率低,具有优异的综合性能,所制得的12层印制电路板可以满足通常的无铅回流焊制程,经下游PCB客户及终端评估获得通过。

As the requirement for protection of environment is becoming stricter and stricter, the requirement of non-phosphorus was put forward after the halogen-free requirement of copper clad laminate(CCL). In this paper, the new Environment Protection Act of Sweden regarding halogen-free and non-phosphorus requirement was introduced. Also, the development approach of halogen-free and non-phosphorus CCL was explained. A halogenfree and non-phosphorus heat resistant CCL was prepared, which could meet the requirement of the new Sweden Act. The test results showed that the halogen-free and non-phosphorus CCL had excellent flame resistance, high heat resistance, low water absorption, and outstanding comprehensive performance. The 12-layer PCB made by this CCL could pass lead-free reflow for 6 times. And it also passed the qualification test of PCB customers and end users.